It offers an 8–10-minute working time and cures to a tack-free transparent layer in 30 minutes. Metal, plastic, glass, ceramic, and other substrates provide good adhesion. Non-yellowing characteristics allow optical inspection post-cure.
T-series TF-60C compound, a proprietary blend of PEEK polymer, Celazole polybenzimidazole (PBI), and carbon-fiber reinforcement, can replace polyimides and metals in semiconductor and electronics assembly. TF-60C is a melt-processable thermoplastic that tolerates harsh environments up to 300°C.