BASF joins IMEC partners for 32nm IC cleaning

October 8, 2007 – BASF says it has joined IMEC’s Industrial Affiliation Program to research and develop IC cleaning solutions and advanced interconnects, with an eye toward commercialization for the 32nm in 2010.

The collaboration aims to develop new chemical cleaning technologies offering better performance and reduced complexity, and also fewer number of IC process steps. “”New and less complex manufacturing processes are a must for future IC technologies to be viable,” stated Serge Vanhaelemeersch, department director for advanced materials and process steps at IMEC, noting that such achievements going forward “can only be overcome by joint interdisciplinary teams.”

“By combining IMEC’s strengths with BASF’s broad chemical and application know-how, we can develop innovative cleaning solutions for enabling IC manufacturing processes using 32nm technology,” stated Andreas Klipp, manager of semiconductor materials development in Europe for BASF Electronic Materials.

BASF is already working with IBM to develop 32nm materials, with research done in both the US and Germany.


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