October 12, 2007 – Cookson Electronics is finalizing a three-year expansion of its India Research Center, moving to a 32,000-sq.ft. facility in Bangalore with added personnel and equipment. The company originally opened its India R&D on the Indian Institute of Science (IISc) campus, and will continue its strategic partnership with the school.
The R&D facility hosts many Ph.D.s in materials and chemistry, and will target advanced electronics assembly processes and products, according to Bawa Singh, VP of technology and CTO, Cookson Electronics Assembly Materials (CEAM). Semiconductor manufacturing and packaging technologies will become a priority at the R&D location, as well as renewable energy sources such as solar technologies. Cookson also plans to build up nanotechnology-based material lines.
The Bangalore facility, joining R&D locations in the US, Japan, and Singapore, was established and developed to support Cookson’s Asia growth strategy. The Asia-Pacific region brings in about 60% of the company’s assembly materials business, explained Corbett. Cookson also operates a manufacturing facility in Chennai, India.
Additional reporting from SMT magagazine.