EVGroup Announces Bonder Install

(October 8, 2007) ST. FLORIAN, AUSTRIA — EV Group (EVG) announced the selection and installation of its EVG850TB fully automated temporary wafer bonding system by an Austrian semiconductor manufacturer. They system, designed for high-volume processing of thin- and ultra-thin device wafers, reportedly allows secure and reliable handling of high-value wafers while contributing to higher yield.


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