Henkel Announces Grand Opening of Henkel Huawei Electronics Mold Compound Facility

(October 18, 2007) IRVINE, CA— Henkel Huawei Electronics Co. Ltd., a joint venture of Huawei Electronics and Henkel Corporation, announced plans to unveil its state-of-the-art mold compound manufacturing facility in Lianyungang, China on October 26, 2007. Henkel Huawei Electronics’ continued growth has reportedly necessitated additional manufacturing lines to support its global customer base. The new operation will encompass 16,000 square meters of administrative and manufacturing space and have a total production capacity of 25,000 tons of material annually.


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