IMEC and Georgia Tech Set Out to Solve Packaging Interconnect Gap

(October 16, 2007) Leuven, Belgium — IMEC and the Packaging Research Center (PRC) at Georgia Tech have put out the call for interested parties to join in their advanced research program on next-generation flip chip and substrate technology. The program addresses key IC-to-package-to-board packaging interconnect issues, specifically how to accommodate for fine pitch for 32-nm ICs and beyond.


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