October 11, 2007 — memsstar Technology of Edinburgh, Scotland, has completed introduction of a full range of research, development, and production platforms for its SVR and SPD process chambers, which enable dry isotropic etching and surface coating with ultra thin films.

The company’s SOLO, SENTRY, and MULTI platforms are based on the same process module to facilitate seamless transition as products move through the research, development, and production phases. Manual, semi-automated, and fully automated loading and processing systems, available as interchangeable options, provide options to expensive and time consuming requalification and reengineering. Multiple chemistries and chambers allow MEMS designers and manufacturers to choose among a wide range of sacrificial etch materials and functional coatings.

All systems are based on single-wafer chamber processing that promises high yields and exceptionally low costs compared to other techniques.

“Having already demonstrated the superior process capabilities of the memsstar SVR etch and SPD coating processes in terms of quality and fast process times, we have now added the necessary standard automation and fab integration systems that will allow our customers complete flexibility with high reliability,” said memsstar CEO Mike Leavy. “In addition our modular manufacturing processes and simple design methodologies mean the highest return on investment for our customers.”