Thermally Conductive Compound — Dow Corning

Dow Corning’s TC-5026 Thermally Conductive Compound is a thermal grease used to carry heat away from PC microprocessor chips and other critical components. It is applied in a thin layer between a chip and a heatsink. Due to its ability to thin out to low bond lines, it reportedly provides low thermal resistance, high reliability, and stability under adverse conditions such as thermal cycling, high humidity, and high-temperature aging.


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