Actel Delivers 4×4 mm Package for FPGAs

Complementing its existing portfolio of small 8×8 mm and 5×5 mm packages, the Actel device in the new package is said to offer designers four times the density, three times the I/O and a 36% reduction in size compared to competitive programmable logic devices. Smaller than a kernel of corn, the new IGLOO FPGAs are an ideal solution for power-sensitive, space-constrained handheld devices such as smart phones, portable media players, secure mobile communications devices, remote sensors, security cameras and portable medical devices.

(November 14, 2007) PHOENIX, AZ — FlipChip International has introduced its new Embeddable Die Customization (EDC) technology targeted at readying integrated circuits and other devices for integration into emerging 3D packaging solutions. EDC enables the embedding of semiconductor devices within printed circuit boards or other interconnection schemes, thereby enabling lower profile, more reliable packaging schemes for applications including next generation cell phones.


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