ASE, Infineon Produce Embedded Wafer-level BGA

Under the partnership, ASE will provide packaging for the eWLBs through a licensing structure. The eWLBs will be manufactured at Infineon’s and ASE’s sites under the license model. Commercially available devices are expected by the end of 2008.

(November 13, 2007) Singapore — STATS ChipPAC Ltd., an independent semiconductor test and advanced packaging service provider, has announced its intention to voluntarily delist its American Depositary Shares (ADS) from the Nasdaq Global Select Market (Nasdaq).


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