austriamicro expands wafer services

November 15, 2007 – austriamicrosystems says it is expanding its multiproject wafer (shuttle) ASIC prototyping service in 2008 with high-voltage (CMOS and flash) and RF offerings. The company is planning >150 shuttle start dates, through partnerships with groups including CMP-TIMA, Europractice, Fraunhofer IIS, and MOSIS.

The runs include a range of processes in 0.35-micron based on TSMC’s processes, including a CMOS-compatible SiGe BiCMOS technology for RF (up to 10GHz operating frequency), a high-voltage CMOS process family with 20V (power management and displays), and 50V CMOS options (auto, industrial applications). Also being offered are high-voltage embedded flash, and a 0.18-micron high-voltage CMOS technology based on IBM’s CMOS7RF process.

A full schedule of MPW shuttle runs in 2008 is available at austriamicrosystems’ Web site.


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