December 2007 Exclusive Feature #1: “In-the-trenches” roundup of ISMI

By Debra Vogler, Senior Technical Editor

The tradition of the ISMI Manufacturing Symposium as an “in the trenches” conference, by and for the people doing the actual day-to-day work in the fabs, continued Oct. 24-25 in Austin, TX. Particular attention was given to topics on yield improvement/productivity methodologies, ESH, and sustainability. Specific talks included how to fix litho “hot spots,” cleaning wafer chucks without DI water or solvents, guidelines for detecting/preventing electrostatic discharge (ESD) events, and why process stability may be the deciding factor in the battle over 450mm wafers.

To read the complete article, click here


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.