(November 1, 2007) ST. FLORIAN, Austria — EV Group (EVG) has successfully installed its 500th bond chamber and 100th automated production wafer bonder for high-volume manufacturing (HVM).
(November 1, 2007) ST. FLORIAN, Austria — EV Group (EVG) has successfully installed its 500th bond chamber and 100th automated production wafer bonder for high-volume manufacturing (HVM).
Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.