FlipChip to Expand DSD Fab to 3M Die/Wk Capacity

The expansion also includes additional dicing tools, which have increased capacity by 50% for the singulation wafer to die process at DSD. To support the additional tool sets, a major facility expansion was completed to add 30% in cleanroom space, additional secured raw material storage and expanded warehouse space.

(November 12, 2007) Santa Clara, CA — Two more companies have announced they will be presenting their latest technology at this week’s IMAPS International Symposium. Antares Advanced Test Technologies, Vancouver, WA, will discuss the nuances of back-end signal integrity and showcase its latest BGA burn-in technology at Booth #1130. Dage Precision Industries, Fremont, CA, will showcase its newest bond test developments in Booth #608.


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