FlipChip’s EDC Enables Embedded Die Packaging

The versatility of FCI’s EDC technology supports the integration of most emerging embedded die technologies whether based on laser via, photo-via or plasma etched via build up technologies. Additionally, the combination of FCI’s EDC technology and widely accepted thin film redistribution building blocks enables cost-effective component I/O pitch reduction, and inherent loosening of bare die component placement requirements. This feature addresses one of the major technological hurdles to embedded die packaging schemes and provides practical alternatives for overall process simplification and cost reduction.

(November 14, 2007) CHANDLER, AZ — Microchip Technology Inc., a provider of microcontroller and analog semiconductors, today announced the MCP4725 digital-to-analog converter (DAC) that combines integrated EEPROM and 12-bit resolution in a miniature, 6-pin SOT-23 package. The low-power, single-channel DAC has a buffered voltage output and can be used in space-constrained portable and battery-powered applications.


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