Fred Roozeboom, Ph.D., of NXP Joins EMC3D Consortium as Technical Advisor

Roozeboom joins a distinguished team of industry researchers devoted to creating a cost-effective 3D integration method. The technical team consists of both semiconductor materials companies and equipment companies, including technology groups Fraunhofer IZM in Berlin, KAIST (Korea Advanced Institute of Science and Technology), SAIT (Samsung Advanced Institute of Technology), CEA-LETI in France, and TAMU (Texas A&M University).

(November 15, 2007) Saint-JEOIRE, France — S.E.T., the former SUSS MicroTec Device Bonder Division, has announced that the partnership between S.E.T. and CEA Leti has resulted in a radically new-generation, high-accuracy (0.5 µm), high-force (4000 N) device bonder for wafer diameters up to 300 mm. The FC300 bonder includes a built-in chamber for collective reflow in a gas or vacuum environment and also features nanoimprinting capabilities.


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