From the Editor
Keeping the Home Fires Burning

Although I prefer the activity and excitement of being at shows to the quiet contemplation of my desk, it was a great opportunity to catch up on current news, and find nuggets of interesting technology for potential features to fill our 2008 editorial calendar. Industry Forecast responses began filling my inbox, but since many of you were busy with the aforementioned shows, we’ve decided to extend the deadline to Monday, November 26 to make sure that those of you who wanted to respond, get the chance.

(November 20, 2007) SHANGHAI, China — STATS ChipPAC Ltd. has announced that it is expanding its flip chip offering to provide customers a complete turnkey solution in China. STATS ChipPAC’s operation in Shanghai, China will provide high-volume, low cost, full turnkey flip chip solutions encompassing wafer bump, sort, assembly, and final test.


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