The EnviroMark 919G (EM919G) lead-free solder paste is 100% halide- and halogen-free, representing a critical innovation in soldering materials chemistry. The paste has ultra-low voiding characteristics, lighter flux residue color, shiny joints, good solderability on all typical component and board finishes, and easier residue penetration. Its good print characteristic to 0.4mm pitch, stable tack and stencil life with long idle time between prints ensure a reduction in print defects and paste waste. The enhanced chemistry in the flux provides the necessary cold and hot slump resistance essential in a lead-free reflow thermal profile. The improvements in chemistry reduce potential defects such as bridging, solder balls, and tombstoning. Kester, Itasca, IL, www.kester.com. Booth #A4-363