IMAPS Preview Update

Antares, a global supplier of integrated semiconductor-test consumables, announced that Hongjun Yao, signal integrity manager, will deliver a presentation titled “The Effect of Package Pin Map On Signal Integrity for Test Applications” at IMAPS 2007 on Wed., Nov. 14 at 3:35 pm.

(November 13, 2007) KAOHSIUNG, Taiwan, and NEUBIBERG, Germany — Advanced Semiconductor Engineering Inc. (ASE) and Infineon Technologies have developed a new packaging technology using embedded wafer-level ball grid arrays (eWLB) that reportedly offer an almost infinite number of contact elements in a 30% smaller package form vs. conventional lead-frame laminate packages.


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