MEMS and packaging/test groups form alliance

November 20, 2007 — The MEMS Industry Group (MIG) and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed a strategic alliance to support each other’s goals and industry events, through a variety of marketing programs.

MEMS device manufacturing presents special challenges, including the ability to withstand electromechanical, thermomechanical and other stressors and still remain robust and reliable, MEPTEC President Bette Cooper said in a statement. “Bridging the gap between standard semiconductor packaging and MEMS packaging is one way to address these challenges, and it is this convergence that has been our focus,” she said.

Among the joint efforts, the two groups will support each other’s upcoming events. MIG cosponsored MEPTEC’s recent substrates symposium (Nov. 8, Santa Clara, Calif.). And MIG will conduct a packaging survey at its annual membership’s technical event, METRIC (May 7-9, 2008), and reveal the results at MEPTEC’s annual MEMS Symposium on May 22. Both firms also will cross-promote each other’s events to their respective memberships.


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