Mitsubishi unit tips new CMP ring material

November 21, 2007 – Nippon Polypenco Ltd., a subsidiary of Mitsubishi Plastics Inc., is shipping a durable material for retaining rings used in the CMP process of semiconductor manufacturing, notes the Nikkei Business Daily.

Now shipping in samples, “Semitron CMP XL20,” developed by Polypenco’s 45% stakeholder, Swiss-based Quadrant Group, is a wear-resistant formulation of polyamide-imide that lasts 20x longer than conventional CMP retaining ring materials, meaning they don’t have to be replaced as often, saving costs. The material also is highly resistant to CMP chemicals used to planarize oxide and wiring layers on wafers, the paper notes.

A lower-priced version of the CMP ring material, “Semitron CMP LL5,” lasts about a quarter as long as the XL20, but still far longer than conventional materials.

Nippon Polypenco is targeting combined annual sales of the materials of several hundred million yen, but no target date was provided.


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