November 27, 2007 – NEC says it will start mass production of 40nm system chips in late fiscal 2008, days after tipping initial details on two versions of 40nm SoCs.
The company is spending 10B yen (US $M) in the current year to upgrade equipment at its 300mm facilities in Tsuruoka, Yamagata Prefecture, to support production of up to 5000 wafers/month using 55nm technology, of which ~2000WPM will be used for 40nm technology. NEC Yamagata’s total manufacturing capacity will be unchanged at ~13,000WPM. 55nm samples are already shipping.
The first 40nm devices will be advanced system LSIs and ASICs with embedded DRAM, targeting consumer electronics, mobile handsets, and game consoles, according to the company.
For 32nm chips, NEC is working with Toshiba, including developing the exposure method and other production technologies, with eventual 32nm production expected to be done at Toshiba’s site in Oita.