OKI to Miniaturize Camera Modules for Mobile Phones

In September, OKI established a volume production line for through-whole technology based W-CSP assembly at its production site in Tokyo and started operation in October.

(November 8, 2007) ANAHEIM, CA — CHAD Industries Inc., a supplier of factory automation solutions for the semiconductor, electronics, and life sciences industries, has been qualified by Dage, A Nordson Company, as an EFEM (equipment front-end module) supplier. Dage will use a CHAD automated wafer handling system seamlessly integrated into its 4300 wafer bump test system.


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