Partnership Between CEA-Leti, S.E.T. Produces New Bonder

The FC300 bonder is the first step in a joint development program between CEA Leti and S.E.T. A previous joint development effort, as early as 1981, brought about the first ever commercially available flip chip bonder, S.E.T said.

(November 15, 2007) SCOTTSDALE, AZ — Accelerometers — devices that sense motion — have been with us for a long time, but only recently have they have been miniaturized as silicon-based devices. Consumer electronics makers who saw their hidden potential and built new products such as Nintendo’s Wii, Apple’s iPhone, and Activision’s “Guitar Hero” game around them have achieved huge market success by revolutionizing the user-interface.


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