Qimonda reducing 200mm work, 300mm mix reaching 90%

November 30, 2007 – Qimonda says it will reduce its 200mm manufacturing capacities worldwide in an effort to increase work on 300mm activities.

The plan involves discontinuing 200mm contract manufacturing done by Infineon in Dresden, Germany, by March 2008, though Qimonda will continue to have “cornerstone activities” in Dresden for its 300mm manufacturing and R&D. Also part of the plan is reducing 200mm wafer starts in Richmond, VA (US) by 15% while switching capacity from 110nm to 80nm; the remaining 200mm capacity will be used for making legacy products. Qimonda already is discontinuing 200mm capacity at partners Winbond and SMIC by year’s end.

The measures will increase Qimonda’s 300mm mix to about 90% by the end of the current fiscal year, the company noted in a statement.


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