SSMC to Establish Singapore R&D Center

NXP Semiconductors and TSMC (SSMC’s Joint Venture Partners) have expanded the scope of their collaboration, leading to the localization of the process development function. With their combined technical expertise and commercial support, SSMC’s R&D center will focus on development of specialized manufacturing process targeted initially to the E-government solutions, automotive, near-field communication, and RF markets.

(November 8, 2007) Tokyo, Japan — Oki Electric Industry Co. Ltd. has started a contract assembly service for W-CSP (wafer-level chip sized package) semiconductors using through-hole technology. With this technology, sensor and camera module manufacturers can now obtain camera modules that are half the size of conventional modules.


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