November 20, 2007 – STATS ChipPAC says it will expand its flip-chip offerings to its Shanghai, China operation, encompassing wafer bump, sort, assembly and final test.

The first phase of the plan will add and qualify assembly and test equipment specifically tailored to high-volume manufacturing of flip-chip packages, with volume production expected to start in 1H08. A second phase will add electroplated wafer bumping capabilities, for 200mm wafers in 1H07 and 300mm wafers in 2H08.

“As demand for flip-chip technology continues to grow in applications such as high performance ASICs and graphics as well as DSPs and integrated 3D packages for mobile platforms, it will be essential to have a low-cost, high-volume manufacturing location for flip-chip solutions,” particularly in China where customers “are looking for cost effective flip chip technology,” explained Wan Choong Hoe, EVP and COO of STATS ChipPAC, in a statement.

The new capabilities in China will complement existing bumping capabilities in Taiwan and Singapore, following three years of “aggressive” expansion in flip-chip technology and capacity, and the company views the technology as key to its plans to make its Shanghai operation “into a megasite for full turnkey backend solutions encompassing wafer bump, sort, assembly and final test,” Wan said.