STATS ChipPAC to Offer Full Flip Chip Turnkey in China

The Company is following a two-phased approach to extend its full turnkey flip chip offering to China. The first phase is the addition and qualification of assembly and test equipment specifically tailored to high volume manufacturing of flip chip packages. STATS ChipPAC Shanghai recently completed internal qualification of flip chip assembly and test. Customer qualification is ongoing and is expected to be completed in 4Q07. Volume manufacturing is expected to begin in 1Q08.

(November 20, 2007) HONG KONG — Global Sources and SEMI Taiwan plan to co-locate their Taiwan-based electronics industry shows in 2008. International IC-Taiwan Conference & Exhibition (IIC-Taiwan) and SEMICON Taiwan are scheduled to run from Sept. 9-11, 2008, at the Taipei World Trade Center.


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