SUSS MicroTec Receives Multiple Wafer Level Packing Equipment Orders from ASE

The first order packages were booked in October and November and included several production mask aligners and coat/bake/develop clusters for 200 and 300mm, which will be installed at ASE’s wafer level packaging and redistribution process facility in Kaohsiung, Taiwan.

(November 20, 2007) SAN JOSE, CA &#151 SEMI today reported that worldwide semiconductor manufacturing equipment billings reached $11.13 B in 3Q07. The billings figure is one percent greater than 2Q07 and about one percent greater than the same quarter a year ago.


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