Ultra-low-voiding Solder Paste

The Indium5.1AT lead-free solder paste is a no-clean paste that delivers enhanced finished goods reliability by featuring low voiding at via-in-pad, good printability and good wetting, and a robust reflow profile window. Via-in-pad technology for BGA components has reduced PCB real estate requirements, which can also lead to significantly increased voiding. Indium5.1AT delivers voiding in the 5% range over many different profiles when soldering BGAs with via-in-pad technology. Longer soak-type reflow profiles can help reduce via-in-pad voiding, but that can contribute to poor wetting, solder balling, and shorts. Indium5.1AT offers a very robust processing window that can minimize these potential defects as well as accommodate various board sizes, board densities, and throughput requirements. Indium Corp., Clinton, NY, www.indium.com. Booth #A4-163


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