EV Group and Brewer Science Demo New Ultrathin-Wafer Bonding Technology

The companies’ unique approach is optimized for high-temperature advanced packaging applications. In July 2007, EVG and Brewer Science announced that they had combined Brewer Science’s WaferBOND HT coating materials with EVG’s proven EVG850TB/DB temporary wafer bonding/debonding platform to create a high-yield, high-performance solution for simultaneously debonding and cleaning sub-100-micron thinned wafers up to 300mm in dia.

(December 4, 2007) SANTA CLARA, CA — Agilent Technologies Inc. and Multiprobe Inc. today announced their intent to expand the companies’ strategic partnership. As a result, Agilent will sell and support Multiprobe’s Multiscan atomic force prober (AFP) to customers in Asia and Japan.


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