December 5, 2007 — EV Group, which supplies wafer-bonding and lithography equipment for the MEMS and nanotech markets, and Brewer Science Inc., have claimed a “milestone” in handling and processing of ultrathin wafers.

According to a news release from EVG and Brewer Science, a developer of semiconductor technology, the companies have demonstrated temporary wafer bonding capabilities for a wide range of backside processes, including through-silicon vias (TSVs) and backside metallization.

“This latest achievement further validates the viability of the companies’ unique approach, which is optimized for high-temperature advanced packaging applications,” the release said.

The partnership between the companies was formed in July “to address growing industry demand for flexible, yet reliable, processes and equipment that can accommodate the challenges associated with increasingly thin and fragile product wafers — particularly for advanced 3D and wafer-level packaging approaches.”