Flip Chip Bonder Equipment Market Briefing Announced

As the call for higher integration and increased functionality of semiconductor packages continues, various end-user segments will likely become more receptive to flip chip technology, Frost & Sullivan reports. Equipment suppliers continue to develop more system solutions to accommodate this demand and offer higher accuracy machines in response to new package types.

This briefing will benefit equipment manufacturers, distributors, component suppliers, and package developers by discussing current and future trends for the world flip chip bonder equipment market. Highlights of the briefing include: analysis of current and future trends, market drivers, and challenges.

(December 5, 2007) Wilsonville, OR — Mentor Graphics Corp. has announced that Walden C. Rhines, chairman and CEO, will present keynotes at two upcoming conferences in India. The first presentation will take place at the joint 21st International Conference on VLSI Design and 7th International Conference on Embedded Systems to be held on January 6, 2008 in Hyderabad, India. Then, on January 9, Rhines will speak at the India Semiconductor Association (ISA) Thought Leadership forum in Bangalore.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.