For some time now, analysts have been predicting that the semiconductor industry is becoming more consumer driven, rather than technology driven. For instance, ever since MEMS gyroscopes and accelerometers made their way into Guitar Hero and Nintendo Wii, and tire pressure sensors became mandatory in cars, manufacturing MEMS in high volume has become an industry-wide goal.

(December 4, 2007) ST. FLORIAN, Austria, and ROLLA, MO &#151 In their ongoing joint development work, EV Group (EVG) and Brewer Science Inc. unveiled they have demonstrated temporary wafer bonding capabilities for a wide range of backside processes, including through-silicon vias (TSVs) and backside metallization.