High force device bonder with nanoimprint capabilities

The FC300 high-force (4000N), high accuracy (0.5µm) device bonder for wafer diameters up to 300mm is the first step in a joint development program between CEA Leti and S.E.T. It includes a built-in chamber for collective reflow in a gas or vacuum environment. The system also features nanoimprinting capabilities. The FC300 is able to perform various applications on the same platform with a quick process head reconfiguration. Available at first with automatic handling of chips, templates and small size substrates, the FC300 will be further developed to include a fully automated handling of wafers up to 300mm. S.E.T (former SUSS MicroTec Device Bonder Division), Saint-Jeoire, France; www.set-sas.fr.


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