December 21, 2007 – IBM has agreed to license Infineon Technologies’ 130nm embedded flash technologies, expanding IBM’s custom foundry services capabilities and giving Infineon an extra manufacturing source.
Infineon said it will use IBM foundry services for future products based on the process, which has been in volume production at Infineon plants since early 2006 in advanced microcontroller chips across applications ranging from automotive systems to low-power chip card devices.
For IBM, the deal expands its foundry capabilities for applications needing custom logic and high-density flash memory on a single chip, complementing the company’s analog and mixed-signal work, noted Steve Longoria, VP for semiconductor solutions, IBM Global Engineering Solutions, in a statement. Integration and qualification has begun at IBM’s 200mm fab in Burlington, VT, with preliminary design kit availability planned for 2H08.
“With this collaboration, Infineon leverages the value of its own manufacturing IP, gains a new source for volume manufacturing, and strengthens our working relationship with a long-term partner,” added Peter Bauer, EVP and head of Infineon’s automotive, industrial and multimarket business group.