After customers forward their PWB drawing files to Palomar, the company then coordinates with VMI to procure piece parts and perform SMT processes such as solder stencil, surface mount pick and place, solder reflow, cleaning, and inspection. The assembled parts are then returned to Palomar for microelectronic packaging assembly, test, and shipping. Palomar also offers other services through qualified vendors such as plating, sputtering, wafer dicing, and LED repackaging.
(December 12, 2007) SAN JOSE, CA — Teradyne Inc. and Nextest Systems Corp. have signed a definitive agreement under which Teradyne will acquire Nextest. As a result, Teradyne will expand its served market into the flash memory test segment, estimated to be more than $700M in 2006. Of Nextest’s $95.8M in revenue in CY06, flash memory tester sales totaled about $80M. Upon closing, which is expected in 1Q08, Nextest will be run as a business unit within Teradyne’s Semiconductor Test Division.