“We are very excited about bringing the Applied Precision semiconductor team into our organization,” said Paul F. McLaughlin, chairman and CEO of Rudolph. “This acquisition combines two successful companies with complementary products and technologies, and will accelerate our efforts to be a more complete supplier of back-end equipment and software.”

(December 20, 2007) DUIVEN, The Netherlands
— The restructuring of BE Semiconductor Industries N.V. (Besi), completed this fall, focuses on the centralization of certain global developing, manufacturing, sales, and service activities in order to streamline processes, reduce overhead in the subsidiaries, and improve profitability. The new organizational structure should also facilitate the designing of shared system platforms. Such platforms are scheduled for die bonders and sorting products from Datacon as well as devices for the packaging equipment from Fico.