Scalable Dispensing Platform

The Spectrum S-920 series of scalable dispensing platforms adapts to the needs and requirements of high-volume microelectronics manufacturing and PCB assembly such as flip chip and CSP underfill. The platforms feature technologically advanced and integrated software and hardware control based on Fluidmove XP software with process control features. The Rapid Response Heater system minimizes start-up time by ensuring quick ramp to set point and delivers uniform heat across the entire part surface with its low-mass design, while Controlled Process Heat software can be added for an even higher level of automated heat control. The platform can be configured with single or dual lanes, and one, two or three heat stations depending on capacity, process control, application, and footprint requirements. Dispensing flow rates are up to 500 mg/sec. and shot rates are up to 200 dots/sec. Asymtek, Carlsbad, CA,


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