Sensors strip off packaging with VTI chip-on-MEMS

December 27, 2007 — VTI Technologies has developed manufacturing concepts that offer better ways of combining MEMS and ASIC technology to create smaller, smarter and dramatically lower cost sensing devices suitable for large volume production, according to the company.

The company said the work could open up a raft of new MEMS sensing applications for a wide range of handheld devices.

One of the challenges in sensing technology is to combine the very different requirements of MEMS with that of conventional electronic circuitry at the wafer level. In the first phase of its development work, VTI has been able to demonstrate one approach that uses currently available manufacturing techniques, to make smaller, lower cost devices.

In the second phase, VTI is looking at new manufacturing technologies which will allow more complex sensing devices to be made using wafer-level integrations with the benefits of lower cost volume production and small size.


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