Shinko Electric Licenses Vertical Circuits’ 3D Interconnect Technology

Mitsuharu Shimizu, GM, R&D, of Shinko, said, “VCI’s VIP technology provides us the near thru silicon via (TSV), die level interconnect solution required to meet the high density package form factor for the integration of memory, ASIC, and RF functionality. The combination of these features is being driven extensively by portable consumer devices such as smart phones, music players, solid state drives and digital cameras. We found VCI’s technology particularly appealing because of its ability to seamlessly integrate into our existing manufacturing infrastructure.”

(December 6, 2007) TOKYO &#151 The leading manufacturers of semiconductor equipment project 2007 sales to reach $41.68 billion according to the year-end edition of SEMI’s Capital Equipment Consensus Forecast, released in Tokyo by SEMI at the annual SEMICON Japan exposition.


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