Wafer Probe Card

The TrueScale PP40 wafer probe card is designed to enable high-efficiency and high parallelism wafer probing on advanced wire bond logic and SoC devices. By supporting pad pitches down to 40 microns, this probe card allows IC manufacturers to shrink the size of their test pads, enabling some users to retain a single-row pad layout. This company’s MicroSpring technology provides good positional accuracy over the life of the probe card (designed to support greater than a million touchdowns), and enables small pad sizes. In normal usage, the TrueScale design requires minimal maintenance with no spring positioning adjustment and less frequent cleaning than conventional technologies. The PP40 probe card has proven scrub capabilities for more robust electrical contact. The MicroSpring contacts are designed to penetrate the tough oxide layer on top of aluminum test pads in order to achieve optimal electrical contact. With its scalable MEMS design, TrueScale expands parallelism to the ATE’s limit, allowing the testing of 8


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