Wafer Scale Bump Inspection System

The IBIS-Versalea is a new bump inspection system aimed at silicon wafer bump inspection. IBIS uses conventional interferometry combined with massive parallel data processing to give a production scale inspection tool capable of inspecting and reporting on 3000 bumps/sec. The IBIS range now comprises prototype and production size units for substrate inspection in the form of IBIS-lab and IBIS while the Versalea will be capable of handling 300 mm diameter wafers and all combinations of substrates in panel format. Lloyd Doyle Ltd., Walton on Thames, Surrey, UK; www.lloyd-doyle.com.


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