The model AL2000 automated photonic devices assembly system is a versatile system for diverse device assembly requirements and applications. The platform consists of 6-degree of independence axes for submicron precision alignment that addresses all possible degree of optical (and mechanical) axes, and almost equally accurate pick-and-place positioning capability. It provides various bonding options, including both UV- and thermal-epoxy, soldering, and laser welding with about 1 µm post-bond-shift accuracy. Various fully automated assembly processes include: FTTx transceiver assembly, laser array assembly (e.g., printing applications), pressure sensors, miniature camera modules (e.g., automotive applications), micro-lens positioning and assembly (via epoxy dispensing), miniature solid state laser assembly (e.g., display applications), and panar parallel placement of CCD-arrays. ficonTEC GmbH, Bremen, Germany, www.ficontec.com.