Automated Submicron Bonder

The FEMTO is the newest bonder in the FINEPLACER family, capable of handling the assembly and bonding of laser bars and diodes, flip chips, VCSELs, MEMs, sensors, micro-optics, surface mount photonics, as well as simple die attach. The system combines high accuracy (±0.5 µm) and process flexibility, with a small footprint (1270 x 900 mm). Features include a large working area and automatic pattern recognition and alignment based on motorized X, Y, Z and theta movements. Bonding processes are automatically controlled, requiring no operator intervention during the alignment and bonding procedure. FINETECH, Berlin, Germany;


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