Electroglas patents “active vibration cancellation” tech

Jan. 7, 2008 – Electroglas, a supplier of wafer probing systems for semiconductor manufacturing, has received a patent for its proprietary “active vibration cancellation” hardware and software algorithms.

The technology, incorporated as a feature in the company’s EG6000 wafer prober, stabilizes contact resistance during the wafer sort process, maintaining device electrical contact even in a “less than perfect” raised-floor environment with the presence of tool-to-tool vibrations that can cause excessive bond pad scrub/damage, unstable electrical contact resistance, and ultimately yield loss, the company explained in a statement. The AVC technology also means customers don’t have to invest in other vibration isolation infrastructures employed in other probing equipment, the firm said.

The company says negotiations are underway with other semiconductor suppliers to incorporate the AVC control system in applications requiring precise motion system-to-workpiece control, such as MEMS assembly and inspection.


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