High-performance Socket for QFN Packages

The SG-MLF-7025 high-performance QFN socket is designed to accommodate 0.5-mm pitch IC packages. Simply attach the socket to the PCB, drop in chip, and place the lid. The open lid allows probing of die or direct injection of heat or cooling air. Constructed with high-performance and low-inductance elastomer, the sockets suit a 10-mm package size, and operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss. They reportedly dissipate up to several watts without extra heatsinking and can handle up to 100 watts with custom heatsink. Contact resistance is said to be typically 23 m-ohm per pin. The socket connects all pins and the optional center power pad with 10+ GHz bandwidth on all connections. Temperature range is
–35°C to +100°C. Pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. Ironwood Electronics, Burnsville, MN; www.ironwoodelectronics.com.


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