JSPA gets Korea patent for LED wafer scribing

Jan. 4, 2008 – JP Sercel Associates says it has been awarded a patent in Korea for its front-side laser scribing technique for LED wafers, which uses a unique laser energy distribution technique to allow extremely narrow kerf widths (2.5μm wide), resulting in faster processing, higher yields, and more die/wafer.

Using this technology, the company’s IX-200 Chromadice DPSS UV laser wafer singulation system can process 15 2-in. wafers/hr, “a dramatic increase in throughput compared to diamond scribing and conventional laser techniques,” according to company president Jeffrey Sercel.


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