Jan. 7, 2008 – Metrology equipment supplier Metryx Ltd. and IMEC have formed a joint development program centering on evaluating and developing mass metrology at both the application and tool level for sub-32nm process manufacturing.
The deal follows IMEC’s receipt of two Metryx tools last summer (Mentor SF3/300mm, Mentor OC23/200mm), to be used for monitoring shallow trench isolation, etch, deposition, and CMP for both metal and dielectric layers. The company says the tool can be used inline and directly on device wafers, with “atomic-level repeatability” and up to 60 WPH throughput for production, test, and blanket wafers, independent of substrate size or material.
“As we continue to scale down line widths to the sub-32nm level, observing the mass characteristics and the changes of a wafer’s mass becomes even more critical,” said Metryx president/CEO Adrian Kiermasz, in a statement. “Collaborating with IMEC provides us with an excellent platform to demonstrate the effectiveness and versatility of the technology across a number of process applications.”
“Mass metrology gives us extremely good insight into both process development and process stability,” added Serge Vanhaelemeersch, director of advanced materials and process steps at IMEC. “At the sub-32nm level, any slight variation in a deposition or etch process can be highlighted immediately and with a great deal of accuracy. With such precision, we know whether we are right or wrong at a very early stage, which could significantly reduce development time and scrap.”