“Everything we’re doing has been done on a macro scale. We are just scaling it down,” said Akinwande, a professor of electrical engineering and computer science and member of MIT’s Microsystems Technology Laboratories (MTL).
(January 16, 2008) SAN JOSE, CA Tessera Technologies Inc. has announced that it has licensed its OptiML wafer-level camera (WLC) technology and SHELLCASE wafer-level chip scale packaging (WLCSP) solutions to Nemotek S.A. The combination of these consumer optics technologies enables Nemotek to offer a full range of cost-efficient camera solutions from wafer-level packaging of image sensors and wafer-level lenses to fully-integrated camera modules.